============================================================================= AST RESEARCH, INC. TECHNICAL BULLETIN #0690 06-18-91 ============================================================================= EXCESSIVE HEAT IN TOWER EISA SYSTEMS Tower EISA systems with 80486 processor boards installed exhibit intermittent failures under certain operating environments. Normally under these conditions there are one or more Host Bus Adapters (HBA's) or multiple network interface cards installed in the system as well as the processor card. The failures exhibited are: - Complete system halts, forcing a reset of the system, - Error messages generated by the operating system in use. The cause of these intermittent failures has been proven to be caused by excessive heat buildup in the tower enclosure due to improper placement or installation of the enclosure itself. To insure proper operation of Tower EISA systems in all operating environments, the following guidelines must be met: 1. Proper ventilation must be supplied for the Tower enclosure 2. Ambient air temperature must be within the specifications stated in the Tower User's Manual. 3. All system covers, including drive bay covers, must be installed while the system is operating. These enclosures are designed for optimal air flow with the covers in place. 4. The processor board installed in the system must be a particular revision level. The processor boards listed below have a vented bracket (AST part number 200412-001) installed which aids air flow. Processor Board Part Number Revision 486-25 202361-002 N 486-33 202361-004 D 486-25 202361-005 D 486-25 202361-006 B 486-33 202361-007 B 486-25 202397-001 X3 486-33 202397-002 B